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Based on the instrumented indentation technique, an indentation tester with nanometer accuracy, which integrate the functions of driving, measuring, controlling and data-analyzing together, is presented in this paper. The test's intermediate error is decreased by loading with voice coil actuator without transmission mechanism. And the signal is acquired from high-precision capacitive displacement...
A absorbent was chose to absorb CS2 from industrial activated carbon (AC), 13X, NaY, ZSM-5. The results indicate that the adsorption of CS2 of the industrial activated carbon is better than the others. The modification of industrial activated carbon (AC) has been used in laboratory in order to make full use of high concentration CO comprehensively. AC was impregnated with Cu(Ac)2, Zn(Ac)2, Mn(Ac)2...
A new method based on cataluminescence (CTL) generated on the surface of nanosized Bi2O3 was proposed for direct determination of benzene in air. Trace benzene was firstly absorbed on active carbon at room temperature to concentrate, then desorbed at 130°C to inject. The method showed high selectivity to benzene at wavelength of 440 nm, satisfying activity at reaction temperature of 315°C and good...
GH4169 is a difficult-to-cut nickel-based superalloy commonly used in aerospace industry. This paper presents a cutting force prediction model in the end milling of GH4169 superalloy with carbide tools by orthogonal experiment. The variance analysis is applied to check the significance of the model, accuracy of the model is verified by experiment. The effect of cutting parameters on the cutting force...
Using high feed milling cutter with indexable inserts, this paper proposes a new method for improving the machining efficiency of small curvature blade surface. First, according to the small cutting depth and high feed characteristics of high feed milling cutter with indexable inserts, the formulas for calculating the cutting depth and cutter location(CL) points' position in 5-axis machining are derived...
It is important to study the environment technology application strategy of the housing industry which will give a comprehensive consideration between the social benefit and the economic benefit, between the long-term benefit and the short-term benefit. How to allocate the limited resources between the rapid demands of more acceptable cost and sales prices residence available and the demands of environment...
Laboratory experiments were employed to investigate the influencing factors of BTEX volatilization. Characteristic of BTEX compounds was critical factor of volatilization; the higher saturated vapor pressure, the greater volatilizing speed. Type and structure of underlying materials determined the volatilization kinetics mode, the influence of channel blocking and adsorption of soils was stronger...
An innovative approach based on partial least square is employed to predict thermal-fatigue property of hot-working steel. By extracting principal components, correlation information between properties of material and thermal-fatigue property under the operating temperature is screened and synthesized. Based on the research results, thermal-fatigue property prediction model of hot-working steel is...
A microprocessor-based touch-screen Human-Machine Interface (HMI) and Programmable Logic Controller (PLC) standard libraries are applied to construct models for creating supervisory control software. This software, in turn, is developed and presented for the Graphical User Interface (GUI) functions used in agriculture wastes reuses process of steam-boiling pretreated to become efficiently produce...
In practice, the determination of the number of endmembers for hyperspectral images of the areas without priori knowledge is highly difficult. This article brings forward an automatic method, which can estimate the number of endmembers for hyperspectral imagery without priori knowledge of the area, according to the theory of orthogonal subspace projection (OSP). The paper carries out the experiments...
A low temperature C2W (Chip to wafer) bonding method is developed for integrating MEMS and electronics into a wafer level package. The diced known good MEMS chip is picked and bonded onto an ASIC wafer using an In based low temperature solder below 200 degC. The C2W bonded MEMS and ASIC wafer is sealed with a cap wafer. The sealed package is characterized for hermeticity and shear strength and found...
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