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On page 1441, D. Wasserman and co‐workers demonstrate a nanostructured thin film formed by engraving a thin, patterned metal layer into a semiconductor substrate via the MacEtch technique. The patterned film allows for enhanced electrical contact and simultaneously transmits more light than a smooth air‐semiconductor interface. The demonstrated approach has the potential for integration with a wide...
Metallic films with subwavelength apertures, integrated into a semiconductor by metal‐assisted chemical etch (MacEtch), demonstrate enhanced transmission when compared to bare semiconductor surfaces. The resulting “buried” metallic structures are characterized spectroscopically and modeled using rigorous coupled wave analysis. These composite materials offer potential integration with optoelectronic...
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