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In this paper, the reliability prediction of a power electronics building block (PEBB) printed circuit board assembly (PCBA) is performed using the Part Stress Method from the MIL-HDBK-217FN2 handbook. The breakdown of the predicted reliability with respect to circuit functional blocks is presented. Furthermore, different cases are shown, where the components with small or large failure rate dominate...
Reliability prediction according to reliability standards is often applied to estimate the reliability of electronic systems. Failure rates are typically dependent on their stress conditions (predominantly thermal and electrical stresses). However, getting the exact temperature and stress value for every single component is extremely time consuming, or sometimes impossible. Here the sensitivity of...
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