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We have developed a spot vacuum sealing method utilizing conventional thermo-compression bonding at 160 °C with a transportable Au particle plug on a silicon through hole. The plug of which diameter is around 200 μm is composed of sub-micron-size Au particles and an Au thin film. The easy deformability of sintered Au particles leads to the hermeticity with changing the structure to closed pore state...
This paper describes a MEMS-CMOS integrated tactile sensor for surface mounting on a flexible and stretchable bus line. The sensor is featured by the following configurations; (1) A sensing diaphragm is formed on a CMOS substrate by backside etching, and (2) the CMOS substrate is flip-bonded to a special low temperature cofired ceramic (LTCC) substrate with Au through vias. The flipped CMOS substrate...
An anodically-bondable low-temperature cofired ceramic (LTCC) wafer is a new wafer-level packaging material for micro electro mechanical systems (MEMS). It provides 3-dimensional metal interconnection inside, and enables hermetic sealing, which was guaranteed by automobile-grade thermal cycling tests. In this study, the sealing pressure was first investigated under various anodic bonding conditions...
This paper reports the wafer-bonding-based integration of heterogeneous devices with different die sizes by laser-assisted selective device transfer technique. 1 mm × 1 mm FBAR (film bulk acoustic resonator) dies supported with a glass wafer were selectively transferred to a wafer of 2 mm × 2 mm BiCMOS sustaining amplifiers by low temperature Au-Au bonding. The FBAR dies left on the support glass...
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