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This paper presents a multi-sensor platform LSI for versatile applications including next generation robots. For a unified system implementation, the proposed LSI, which was fabricated by TSMC0.13μm CMOS process and whose size is 2.83mm × 2.83mm, provides the following functions: several principle sensor readout circuits, 8-single or 4-differential multi-channels for multi-axis sensing, digital outputs...
This paper reports a fully-integrated, small-footprint fingertip sensor, which allows robots to have 3-axis tactile and thermal sensation. The 3-axis capacitive force sensor is integrated with our original sensor platform CMOS-LSI (sensor platform LSI) including a diode-based temperature sensor. The LSI offers flexible configurability, and the force sensitivity and the sample rate were configured...
This paper proposes a 20 mW class low-power and miniaturized oven controlled crystal oscillator (OCXO) by combination of the following two methods. (1) A crystal resonator and a CMOS-LSI for oscillation and oven control circuits are integrated for realizing an integrated OCXO chip. (2) The integrated chip is connected with thin film metal interconnection on a thin polyimide film and is suspended by...
This paper describes a MEMS-CMOS integrated tactile sensor for surface mounting on a flexible and stretchable bus line. The sensor is featured by the following configurations; (1) A sensing diaphragm is formed on a CMOS substrate by backside etching, and (2) the CMOS substrate is flip-bonded to a special low temperature cofired ceramic (LTCC) substrate with Au through vias. The flipped CMOS substrate...
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