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Delamination in semiconductor plastic package is a cause of reliability degradation. We have tried to improve the adhesion strength between leadframe and epoxy resin. In this study, organic molecules–metal (Cu) complex “EC tag (Cu)” were employed. It is immobilized on the leadframe surface as adhesion promoter to adhere with thermosetting epoxy resin. In the results, immobilized EC tag (Cu) act as...
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