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The objective of this paper is to provide an effective and accurate analytical solution to compute the spreading thermal resistance of a vapor chamber thermal module, as well as the surface temperatures and the heat flux distributions at the heating surface. The analytical solutions are expressed in a reduced unit system with the governing parameters of the corresponding distance between heat sources,...
Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi...
The power dissipation of CPU used in desktop computers has been steadily increasing with time. The tendency for a rise in the CPU capacity resulted at present in increasing heat release to 50-100W for desktop PC. The problem of the CPU cooling consists in restricting its temperature to 80-90degC. Current desktop computers use a heat sink of approximately 60 times 80 mm2 base area. Desktop computers...
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