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Temperature-dependent ON-state breakdown (BVON) loci of AlGaN/GaN high-electron-mobility transistors (HEMTs) were experimentally demonstrated for the first time. With gate-current extraction technique, impact ionization was revealed to be responsible for the ON-state breakdown in our device as the HEMTs is marginally turned on. The characteristic electric-field Ei of impact ionization was extracted...
We have performed constant voltage stress (CVS) tests on GaN-on-SiC HEMT to investigate the drain current drift. Two kinds of current drift behavior are observed in CVS. The off-state drain voltage step stress tests are carried out to confirm the electric field dependent current drift. A critical voltage for drain current recovery is observed. We suggest that the recovery of drain current is due to...
Voltage step-stress tests on GaN-on-SiC HEMT showed that electric field is a driving factor for degradation. The position of localized damage is corresponding to the high electric field region. A degradation mode different from previous reports is observed, which led to an increase of drain current after stress in certain conditions. We attribute this to the collection of the positive mobile charge...
The channel temperature of AlGaN/GaN High-Electron-Mobility Transistor was measured by Infrared Microscopy. The behaviors of the channel temperature distribution, the peak channel temperature and the thermal resistance under DC bias were investigated. IR Microscopy facilitates the study of how the device parameters affect reliability.
An internally matched GaN power HEMT has been realized at Ku band with a newly developed three-dimensional (3D) electromagnetic (EM) design technique, in which the internal matching networks are 3D modeled and characterized, as a whole. This single chip device with 4mm gate width delivers 17.8W power output with more than 30% PAE over 13.8 to 14.3GHz with few adjustments after assembling.
High breakdown voltage GaN HEMTs was developed for power electronics application. The device with source connected field plate (FP) was fabricated, which demonstrated perfect hard breakdown characteristics. A high breakdown voltage of 740V was obtained in air ambient while gate-drain spacing Lgd and FP length LFP equaled to 20μm and 2μm respectively. Specific on-resistance of the device was 14mΩ.cm...
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