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In this study, the finite element analysis is chosen to investigate the thermo-mechanical properties of an indium joint exposed to low-temperature cycling. Based on the experimental data, the computational model is built, and the material model of indium is proposed for different joint thickness. The obtained results demonstrate that the outmost corner of the interface between the small indium joint...
The influence of metal interconnect resistance becomes increasingly critical as the power IC technology continues to advance. In this paper, we report a multilayer quasi-3D finite element analysis (FEA) approach to model the influence of metal interconnect resistance of power IC's. We have used this FEA tool to analyze and optimize a large number of metal interconnect designs. Three case studies will...
The issue of metal interconnect resistance becomes increasingly critical as the power MOSFET technology continues to advance. This paper introduces a three-dimensional finite element analysis (FEA) approach to model the influence of source metal on the performance of power MOSFETs with ultra low on-resistance. Various source metal interconnection designs for two commercial discrete packages, the D...
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