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This paper is concerned with the thermal mechanical stability of 3D TSV with initial thermal stress and deformation during working stage. Different from the previous results, integrated circuits (IC) packaging and fabricating process (PFP) is considered to obtain the initial thermal stress and strain for working stage. During the PFP of IC, the through silicon via (TSV) may go through several different...
Graphene has a high thermal conductivity, electrical conductivity and outstanding mechanical properties,which is considered as the good reinforcement material in the composites. In the reported literatures, graphene oxide was generally used as the precursor of reinforcement to electrodeposit the composite film, then followed by the reduction of graphene oxide to graphene. In this paper, the graphene-Cu...
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