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The electrorecrystallization, recrystallization driven by electrical current stressing, of Cu 6 Sn 5 intermetallic compound occurs in a Sn0.7Cu flip chip solder bump. The Cu 6 Sn 5 dissolves in Sn0.7Cu at 1.0 × 10 4 A/cm 2 of current stressing under 150 °C. The Cu flux in the solder joint, driven by the combination force of thermal gradient and electromigration,...
This study aims to investigate the interfacial reactions and cross-interaction of Ni/Sn–3.0Ag–0.5Cu/Cu–xZn (Ni/SAC/Cu–xZn; x = 0, 15, and 30 wt.%) solder joints. In comparison with the Ni/SAC/Cu solder joint, Ni/SAC/Cu–15Zn and Ni/SAC/Cu–30Zn solder joints revealed thinner Cu 6 Sn 5 -based intermetallic compounds (IMCs) at both Ni/SAC and SAC/Cu–Zn interfaces after aging at 150 °C...
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