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Interfacial delamination has been a major reliability issue for both BEoL and packaging systems. The failure is often due to poor adhesion of interfaces. Thus characterization of interfacial properties is critical for material selection and process control. Conventional methods for interfacial adhesion and fracture toughness measurements are generally based on linear elastic fracture mechanics. More...
A series of studies have been conducted for mechanical behavior of elastic thin films on compliant substrates. Under tension, the film may fracture by growing channel cracks. The driving force for channel cracking (i.e., the energy release rate) increases significantly for compliant substrates. Moreover, channel cracking may be accompanied by interfacial delamination. For a film on a relatively compliant...
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