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The CrN and Cr–Al–Si–N films were deposited on Si wafer and SUS 304 substrates by a hybrid coating system with high power impulse magnetron sputtering (HIPIMS) and a DC pulse sputtering using Cr and AlSi targets under N 2 /Ar atmosphere. By varying the sputtering current of the AlSi target in the range of 0–2.5 A, both the Al and Si contents in the films increased gradually from 0 to 19.1%...
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