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A low-cost, fully-integrated antenna-in-package (AiP) solution for 60-GHz phased-array systems is demonstrated. Sixteen patch antennas are integrated into a multilayer organic (MLO) ball grid array (BGA) together with a flip-chip attached transmitter or receiver IC. Compared to the previous 60-GHz package design, the enhanced 24 mm × 24 mm package not only reduces the footprint area by 27%, but it...
A multilayer organic package with embedded 60-GHz antennas and fully integrated with a 60-GHz phased-array transmitter or receiver chip is demonstrated. The package includes sixteen phased-array antennas, an open cavity for housing the flip-chip attached RF chip, and interconnects operating at DC–66 GHz. The 28 mm 28 mm ball grid array package is manufactured using printed circuit board processes...
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