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In this paper, two processes which are adopted to produce TO packaged power devices are concerned about. The relationship between process factors and equivalent stress and deformation in the joint are studied. Finite element simulation method is adopted to analyze the equivalent stress, strain and deformation in the two processes. Results indicate that both the two processes produce large equivalent...
In this paper, two processes which are adopted to produce TO packaged power devices are concerned about. The relationship between process factors and equivalent stress and deformation in the joint are studied. Finite element simulation method is adopted to analyze the equivalent stress, strain and deformation in the two processes. Results indicate that both the two processes produce large equivalent...
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