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An innovative release method of polymer cantilevers with embedded integrated metal electrodes is presented. The fabrication is based on the lithographic patterning of the electrode layout on a wafer surface, covered by two layers of SU-8 polymer: a 10-mum-thick photo-structured layer for the cantilever, and a 200-mum-thick layer for the chip body. The releasing method is based on dry etching of a...
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