The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The Sn3.0Ag0.5Cu (wt.%) lead-free solder alloy is considered to be one of the most promising candidates to replace the traditionally used Sn–Pb solder. However, this alloy composition has some weaknesses, mainly as a result of its higher melting temperature compared to the eutectic Sn–Pb solder. In this paper, lead-free solder alloy nanoparticles of Sn3.0Ag0.5Cu were synthesized by chemical reduction...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.