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In this work, thermal and flow characteristics for the metallic foam heat sinks (FHSs) with the central impingement flow were studied with de-ionized water coolant. Such a flow configuration helps to reduce the pressure drop inherent for straight flow in porous foams. The reduction in the pressure drop is analyzed based on the one-dimensional porous medium model and verified with experimental measurement...
A 2.5D package is referred to as the packaging of multiple chips on an interposer made of silicon or glass featured with through-vias filled with copper as electrical interconnects. Thermal management remains a challenge due to the integration of dissimilar chips such as logic and memory chips on a common interposer in molded package format. In this paper, a partially molded 2.5D package (PM package)...
The use of CFD for thermal analysis in the design of electronic devices has proven to be cost effective and time saving in the ever decreasing product development life cycle, However when the product involves components with several orders of magnitude in length scales, and comprises many fine features which may not be easily simplified because of their random nature, the ability to predict an accurate...
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