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A 2.5D package is referred to as the packaging of multiple chips on an interposer made of silicon or glass featured with through-vias filled with copper as electrical interconnects. Thermal management remains a challenge due to the integration of dissimilar chips such as logic and memory chips on a common interposer in molded package format. In this paper, a partially molded 2.5D package (PM package)...
Device scaling and heterogeneous integration necessitate through silicon vias (TSVs) as interconnects for 2.5D and 3D chip packages for shortened signal transmission, less delay, and more functionality. Proper evaluation of the thermal properties of TSVs is a key to the successful design of the package. On the other hand, the determination of in-plane thermal conductivity is complicated with the thin...
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