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The use of CFD for thermal analysis in the design of electronic devices has proven to be cost effective and time saving in the ever decreasing product development life cycle, However when the product involves components with several orders of magnitude in length scales, and comprises many fine features which may not be easily simplified because of their random nature, the ability to predict an accurate...
Functional burn-in testing has become one of the major benchmark testing for computer processors recently. In this study, the air flow modeling and simulation in functional burn-in systems have been conducted with multiple fans for convection dominated thermal enhancement. In the tray-level modeling, the duct tray with three mother boards and dual processors are constructed with the thermal head on...
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