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Three-dimensional integrated circuits are expected to face increasingly severe thermal challenges and cost issues as the number of stacked ICs increases. Thermal analysis for 3D ICs is urgently required to assist system designers at the early phase of design to identify hot zones. Most thermal analyses obtain detailed temperature distribution by large matrix operations, and hence reduce analysis performance...
As an indispensible part of electronic equipment, the reliability of the whole system is affected by the degradation performance of power MOSFET tube. Based on geometry, material properties and boundary conditions, the repeated testing can be reduced, and the period of failure analysis can be shortened. This article is based on the finite element model of power MOSFET TO-263, electric thermal — mechanical...
As an indispensible part of electronic equipment, the reliability of the whole system is affected by the degradation performance of power MOSFET tube. Based on geometry, material properties and boundary conditions, the repeated testing can be reduced, and the period of failure analysis can be shortened. This article is based on the finite element model of power MOSFET TO-263, electric thermal — mechanical...
With the growing demand of multiprocessor system-on-chip (MPSoC) and 3D IC technology evolution, it is crucial to address power and thermal issues during system architecture design. Electronic system level (ESL) design is an acknowledged effective methodology to explore system design by virtual platforms. However, and to our best knowledge, current ESL virtual platforms only consider the performance...
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