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A simple top down method to fabricate an array of vertically stacked nanowires is presented. By taking advantage of the non-uniformity of the Inductive Coupled Plasma (ICP) etching process to form a scalloped sidewall followed by a subsequent stress limited oxidation step, a narrow silicon fin can be vertically patterned to form stacked nanowires with different cross-sectional shapes. The stacked...
The cross-sectional shape of the stacked silicon nanowires (SiNWs) formed by the Bosch process and stress-limited oxidation is studied in this paper. Under the condition of high temperature oxidation, the resulting nanowires highly resemble the initial shaped resulting by the Bosch process. The effects of etching and passivation in the Bosch process is modeled to provide a guideline to control the...
A simple top-down method for realizing an array of vertically stacked nanowires is presented. The process utilizes the nonuniformity in inductively coupled plasma (ICP) etching to form a scallop pattern at the sidewall of a tall silicon ridge that is further trimmed to form stacked nanowires by stress-limited oxidation. The process has been demonstrated to be controllable and repeatable, starting...
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