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In this study, the metallurgical reaction between Cu substrates (electrolytic type) and a Sn3Ag0.5Cu-xPd alloy at 180°C was examined using a scanning electron microscope (SEM), electron probe microanalyzer (EPMA), focused ion beam (FIB) microscope, and transmission electron microscope (TEM). The results showed that the growth of Cu3Sn in the Cu/Sn-Ag-Cu solder joints was substantially suppressed by...
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