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The original purpose of the Re-Distribution Layers(RDL) was to assist in the adaption of metal bumping and flipchip packaging technologies, by the addition of the metal anddielectric layers onto the wafer surface to re-route the legacydesigned irregular peripheral I/O layout, into a new area arraybond pads layout to facilitate a balanced metal bumps and flipchip bonding. The redistribution layer technology...
A high density 50K∼100K/mm2 cross-tier connection featuring backside through-via (BTV) and wafer level 3D stacking technologies has been successfully demonstrated. Wafer stacking and thinning to < 1/250 Si thickness process showed little to no impact to advanced device performance. BTV induced stress effect was also studied; quite different behaviors between wafers with SiGe and without SiGe process...
Stress effects during metal migration and their numerical modeling methods are reviewed. A multi-physics simulation method is proposed and developed so that the electric current and stress can be solved simultaneously and the vacancy concentration predicted in a seamless framework. The stress generated by atomic movement and back stress effects [1] have been especially considered and modeled in this...
This paper presents a high performance capacitive micromachined ultrasound sensor (CMUS) with a large fractional bandwidth (FB) ∼113 % and a low bias voltage of 5 V in an immersion testing of an ultrasonic sensor. The thin polysilicon for the CMOS gate was utilized as a sacrificial layer and the multiple layers of metal and dielectric for the CMOS electric interconnects were used as the structural...
The effects of top metal contacts on the leakage current and breakdown characteristics of HfO2 metal-insulator-metal (MIM) capacitors were investigated. It is found that the breakdown field strength of the devices scales with the work function of the top electrode; the higher the metal work function the higher the breakdown field strength of the devices. This observation is attributed to the different...
In this paper, thick film chip resistors with two different types of solder alloys namely SnPb and SnAgCu have been evaluated for the effects of the solder alloy elemental composition on the solder joint failures under cyclic temperature loading conditions. The creep properties of both solders have been modelled using the Garofalo equation and the creep strain energy density has been extracted and...
Microdrawing is an important process of fabricating the microparts, especially the metal microparts. Under the micro tension test, it was found that the stress-strain curve increased steeply in the elastic deformation stage but gradually in the plastic deformation stage, with the decrease of the grain size. According to the stress-strain curve, the material model was established. Then the influence...
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