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This work presents superb chip-level reliability of a BE-SONOS charge trapping NAND fabricated in both 75nm and 38nm half-pitches. Without any error correction (ECC) >;100K P/E cycling endurance for SLC and >;3K endurance for MLC are obtained using a novel non-cut SiN trapping layer. Key process integration strategies are discussed, including barrier and trapping layer engineering, p-well and...
An 8-layer, 75 nm half-pitch, 3D stacked vertical-gate (VG) TFT BE-SONOS NAND Flash array is fabricated and characterized. We propose a buried-channel (n-type well) device to improve the read current of TFT NAND, and it also allows the junction-free structure which is particularly important for 3D stackable devices. Large self-boosting disturb-free memory window (6V) can be obtained in our device,...
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