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Complicated processes of through-silicon-via fabrication makes low yield of through-silicon-via mass production. Through-silicon-via redundancy is one of various ways that have been put forward to improve reliability of electrical interconnections. Allocation of through-silicon-vias is changed as redundant through-silicon-vias are added. Consequently, thermal dissipation and thermal mechanical reliability...
This paper studies how the underfill with viscoelastic properties impacts the thermal mechanical reliability of a 3D-TSV package system. The Williams-Landel-Ferry equation and the relaxation modulus function in Prony series are used to characterize the viscoelasticity that is both temperature-dependent and time-dependent. The finite element model subjected to a thermal cycle consists of a four-layer...
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