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Chip stacks are a crucial building block in advanced 3D microsystem architectures and can accommodate shorter interconnect distances between devices, reduced power dissipation, and improved electrical performance. Although enhanced conduction can serve to transfer the dissipated heat to the top and sides of the package and/or down to the underlying PCB, effective thermal management of stacked chips...
Pool boiling and CHF experiments were performed for vertical, rectangular parallel-plate channels immersed in the dielectric liquid FC-72 at atmospheric pressure to elucidate the effects of geometrical confinement in immersion cooled electronics applications. Heat transfer enhancement in the low flux region of the nucleate boiling curve was observed for channel spacings near and below expected bubble...
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