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The copper electroplating stress measurement method uses the grain growth in the copper on a machine element that has been subjected to repeated loads. Because this growth is also caused by thermal energy, the effect of the ambient temperature on grain growth density and grain orientation was investigated. Cyclic torsion tests were carried out at temperatures from 293 to 353 K. The relationship among...
Abstract: The copper electroplating stress measurement method uses the grain growth in copper foil. The grain growth is a kind of thermal recrystallisation that is affected by the magnitude of pre‐straining. As a lot of grain nucleation occurs at the large pre‐straining, the large shearing stress should also lead to the same effect. On the basis of the above, we investigate the stress dependence...
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