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Cu with high density nanotwins has been proven to possess excellent mechanical properties and electrical properties. In this study, nanotwins have been successfully introduced in Cu thin films and interconnect lines in trenches down to 150 nm line width. Nanoindentation measurements of hardness show that Cu with some amount of nanotwins has much higher hardness than that of bulk Cu. More interestingly,...
In flip chip package, the majority of heat is from the die side and a temperature gradient builds up from the chip to substrate through the solder joint and underfill. This will induces biased atomic flux from hot end to cold end in the solder. Even in electromigration test vehicle, the joule heating from the Al trace at chip side is also higher than substrate side. Any small temperature difference...
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