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In this paper, a mechanical lock is first proposed and designed for LED silicone lens mounting. Since LED has many new applications in areas such as automobile headlight, micro-projector and local network optical communication, a potential serious issue must be solved. Due to the poor adhension between silicone and mostly materials including silicon, silicone lens may drop off from the silicon substrate...
During SOI-based gyroscope fabrication, wet etching in hydrofluoric acid is utilized to etch buried oxide layer(BOX) and release micro-structures of the gyroscope. The BOX layer is beneath the micro-structures, and it's not easy to observe when the release process is finished, so a gradual release experiment is conducted to find the right etch time. Release experiment is carried out in two kinds of...
In this paper, experiments were carried out to fabricate a kind of free-standing silicon nitride thin film which was applied to many MEMS devices, especially for the gas flow sensors and Pirani. A series of manufacturing processes were researched and optimized to obtain perfect experimental results. LPCVD silicon nitride, dry etching silicon nitride and wet etching silicon were carefully studied in...
In this paper, a wafer-level packaging method for white light emitting diodes (LEDs)—which uses a silicon substrate with cavities and through silicon vias (TSVs)—is presented. Common semiconductor manufacture processes are used to fabricate the substrate. Some key processes, such as wet etching, electroplating, and wire bonding are studied and optimized. This method offers a compact and low profile...
We analyze the problem of Trusted Network Connection (TNC) and descript Direct Anonymous Attestation protocol (DAA). A new key distribution scheme based on host integrity and identity is taken out for identity verify, host integrity checking and group key distribution. After this, we bring forward members join protocol and members remove protocol. At Last this paper analyzes the security of this scheme.
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