The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Eutectic Sn–Bi and In–Sn solders possess much higher damping capacities than Sn–Ag–Cu solders at temperatures above room temperature. The strain amplitude dependence of damping capacities in Sn–Bi solder determined at room temperature is comparable to that of Mg alloys measured at the same temperature. Sn–Bi and In–Sn solders both exhibit conspicuous high-temperature damping backgrounds, with activation...
Sn–37Pb solder and pure Sn metal exhibit a conspicuous high-temperature damping background (HTDB) in low-frequency internal friction Q-1(T) curves with activation energies, H, of HTDB being 0.43 and 0.98eV, respectively. Sn–37Pb solder has a lamellar eutectic structure that can promote the diffusion-assisted climb of dislocations, resulting in lower H. Sn–3Ag–0.5Cu solder shows no HTDB in Q-1(T) curves...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.