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This paper presents key techniques in Long-Term Evolution (LTE) and LTE-Advanced as well as its potential applications. LTE supports peak rates up to 300 Mbps in downlink (DL) and 75 Mbps in uplink (UL), whereas LTE-Advanced would support 1.2 Gbps in DL and 600 Mbps in UL [1]. Since both peak and average throughput are dramatically improved compared to High-Speed Packet Access (HSPA) [2], LTE and...
This paper presents a new high frequency inverter for high power induction heating applications under a low utility voltage condition. This inverter realizes 2 functions in same time. One is a boost chopper function and other is a full bridge inverter. The boost chopper function of this inverter raises the DC bus voltage than an input voltage. Herewith, the boost chopper and one bridge realize an...
In this paper, a position detection sensor for 3-D measurement is presented. The sensor is designed for detecting positions of laser spots projected on target objects quickly. The sensor has a 256×256 pixel array, a set of address decoders for variable block access and a variable block logical-OR circuit on an 8.9mm × 8.9mm die. The sensor is designed and fabricated in 0.6 µm 3-Metal 2-Poly-Si CMOS...
A new high-speed packaging system using a heat-shrinkable tube and an adhesive inner tube for optical fibre fusion splices is proposed. High-speed packaging of less than 0.5 min is achieved by electrical-resistance heating or by induction heating of a strength member rod, inserted into the tubes.
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