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MIS (Molded Interconnect System) substrate, as a type of coreless substrate, has the advantages of lower profile and higher electrical performance. However, warpage would be one of the major concern without the mechanical support of the core material. In this study, warpage of multilayered MIS substrate has been simulated using finite element analysis (FEA). Coefficients of thermal expansion (CTE)...
With merits like high I/O density, superior electrical and thermal performance, and small form factor, flip chip has become more and more widely used in electronic packages. Although the flip chip packaging process has been fairly improved, the conventional CUF (Capillary Underfill) process is a bottleneck that results in lower productivity and higher cost. MUF (Molded Underfill) process offers an...
With merits like high I/O density, superior electrical and thermal performance, and small form factor, flip chip has become more and more widely used in electronic packages. Although the flip chip packaging process has been fairly improved, the conventional CUF (Capillary Underfill) process is a bottleneck that results in lower productivity and higher cost. MUF (Molded Underfill) process offers an...
QFN (Quad Flat No-lead) packages become popular in recent years because they provide many advantages over conventional leadframe packages. Due to CTE (Coefficient of Thermal Expansion) mismatch of different materials applied in the package, significant warpage will be generated during QFN packaging process, and may cause yield and reliability issues. In this paper, the warpage of a QFN strip induced...
Epoxy Molding Compound (EMC) is the encapsulation material that can provide mechanical support and protection to IC packages. In the meantime, it is also a key contributor to package warpage. Finite element analysis (FEA) has been widely used in packaging development to improve product performance more efficiently. EMC is usually modeled as piecewise linear elastic material in FEA model for simplification...
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