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In terms of relative normalized gain array (RNGA) criterion, this paper presents an interaction analysis and loop pairing method for multi-input-multi-output (MIMO) processes described by Type-2 Takagi-Sugeno (T-S) fuzzy models. Type-2 fuzzy system offers a significant improvement on traditional (Type-1) fuzzy systems to handle the uncertainties. For each individual loop in the MIMO process, the steady-state...
With the rapid development of semiconductor industry, reducing time-to-market and cost become very important for manufacturing companies during product development. Generally, customized substrate is required for each chip design in IC packaging. However, design and manufacture of customized substrate usually take several weeks, which significantly impact cycle time of product development. To solve...
The combined effects of thermomigration (TM) and electromigration (EM) were investigated in Cu/Sn3.0Ag0.5Cu/Ni solder joints by applying a 5×103A/cm2 DC current to the joints. With a thermal gradient, the Cu atoms and Ni atoms were found to migrate towards the lower temperature side while the Sn atoms were found to migrate towards the higher temperature side. For the solder joint stressed with a 5×10...
Reballing involves removing the original solder balls and attaching new solder balls on the pads of ball grid array components. In this study, 676 I/O BGAs with Sn3.0Ag0.5Cu (SAC305) balls were reballed with eutectic tin-lead solder. The original metallization of the pads on the BGAs was Cu/Ni with immersion Au. Two solder ball removal methods were applied: the low-temperature wave solder method and...
Flash gold with nickel and gold plating is a low-cost technique in PCB finishing, frequently used in the production of toys. The quality of plating has become one of the concerns for the performance and reliability of solderability. This study investigates the solderability of PCB produced by flash gold finish and traditional nickel and gold plating finish. For this purpose, solderability tests have...
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