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Severe and unexpected yield loss (∼26% in avg.) is found in the early development stage of the advanced flash memory. The major failure mode, array bridging contact, is revealed as the root cause and mainly induced by undercutting photo-resist (PR) profile. In this work, a novel scheme, anti-etch bottom anti-reflective coating (anti-etch BARC), is used instead of the conventional dual ARC (BARC/dielectric...
This work presents superb chip-level reliability of a BE-SONOS charge trapping NAND fabricated in both 75nm and 38nm half-pitches. Without any error correction (ECC) >;100K P/E cycling endurance for SLC and >;3K endurance for MLC are obtained using a novel non-cut SiN trapping layer. Key process integration strategies are discussed, including barrier and trapping layer engineering, p-well and...
For Solid-State Drive (SSD) applications cycling endurance of NAND flash is a critical challenge. In this work the endurance reliability of BE-SONOS NAND is thoroughly examined. Using dual CV/IV tests the impact of interface state (Dit) generation/annealing and real charge trapping (Q) on the endurance degradation has been clearly identified. For BE-SONOS with pure thermal oxide O1, the endurance...
The impact of edge fringing field effect on charge-trapping (CT) NAND Flash with various STI structures (including near-planar, body-tied FinFET, self-aligned (SA) STI, and gate-all-around (GAA) devices) is extensively studied for a thorough understanding. First, we find that the edge fringing field can cause abnormal subthreshold current during programming. Careful well doping optimization is necessary...
Sub-30 nm TFT CT NAND flash devices have been extensively studied. Although TFT devices were often believed to have much worse performance than bulk devices, our results show that as devices scale down to sub-30 nm, the DC characteristics (such as read current and subthreshold slope (S.S.)) approach those of the bulk devices because sub-30 nm TFT devices often contain no grain boundaries. The memory...
Sub-40nm body-tied FinFET BE-SONOS NAND Flash is studied extensively. BE-SONOS offers efficient hole tunneling erase and excellent data retention. When integrated into a FinFET structure, the inherent field enhancement (FE) effect around the fin tip provides very faster program/erase speed. However, the non-uniform injection around the fin also greatly complicates the operation of FinFET BE-SONOS...
A high-performance body tied FinFET BE-SONOS device is demonstrated, suitable for NAND Flash memory scaling beyond 30 nm technology node. BE-SONOS offers efficient hole tunneling erase and excellent data retention. When integrated into a FinFET structure, a much higher program/erase speed is obtained, owing to the inherent field enhancement (FE) effect around the fin tip. In this work, a very scaled...
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