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Porous materials have drawn attention from scientists in many fields such as life sciences, catalysis and photonics since they can be used to induce some materials growth as expected. Especially, porous Langmuir–Blodgett (LB) film is an ideal material with controlled thickness and flat surface. In this paper, stearic acid (SA), which has been extensively explored in LB film technique, is chosen as...
Single damascene (SD) Cu/Aurorareg ULK interconnects with a minimum spacing of 50nm are achieved by using a metal hard mask (MHM) integration scheme, which enables to perform the resist ash before dielectric etch. This patterning scheme is used in combination with a low damage etch technique based on sidewall protection. Interconnect performance and reliability can be further improved by using Aurora...
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