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In this study, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip area ratio, epoxy molding compound (EMC), chip EMC cap, carrier material and thickness, and die-attach film, on the warpage after post mold cure (PMC) and...
In order to study the dynamic response of passengers, neck tissues during low-speed rear-ending, four groups of speed and acceleration data in real rear-ending were used in the simulating calculations with finite element model of 50th percentile adult (Chinese census), to study dynamic response and injury of neck tissues. Simulation results indicated that injury occurs in different tissues with different...
The pellet mill is widely used in many fields such as seed processing industry, new energy technology, pharmacy industry and so on. As we know, the ring die and the press roller are vital to the pellet mill. Therefore, a mechanical model is set up to describe the force which acts on the internal surface of the ring die. Based on the model, FEA is put up with ANSYS to obtain the axial stresses, the...
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