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Considerable scientific efforts were made in the past decade, to come up with reliable and predictive analyses for lead-free solder interconnects, in view of their obligatory introduction a few years ago. This paper concentrates on a number of physical, computational and experimental multi-scale aspects, based on the analyses of the instabilities that occur in a Sn-Ag-Cu (SAC) alloy. Particular attention...
A novel test frame configuration was developed and employed to design a new miniature mixed mode bending (MMMB) setup for in-situ characterization of interface delamination in miniature multi-layer structures to accomplish full range of mode mixities. This advanced setup is specially designed with sufficiently small dimensions to fit in a scanning electron microscope and under an optical microscope...
Interfacial failure, mainly in the form of debonding or delamination of brittle interfaces, is one of the major sources of failure in microsystems that consist of multiple thin and stacked layers, manufactured using different materials. A cohesive zone model with a simple traction- separation law is employed to simulate the benchmark test of pure mode I delamination in a double cantilever beam. A...
In ball grid array (BGA) packages, solder balls are exposed to cyclic thermo-mechanical strains arising from the thermal mismatch between package components. Since fatigue cracks in solder balls are observed generally at the chip side junction, dedicated fatigue experiments are conducted using eutectic SnAgCu- Ni/Au specimens in order to mechanically characterize the bonding interface. Sn based solders...
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