The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this work, the 14 nm CPI (Chip and Package Interaction) challenges, development and qualification were investigated by using 80 um pitch Cu pillar BOL (Bump on Lead) technology in flip chip CSP package. We evaluated 14 nm BEOL (Backend of Line) film strength and adhesion in the torture tests as an early assessment. After passing the torture tests, the package is evaluated in the CPI reliability...
In this work, the 14 nm CPI (Chip and Package Interaction) challenges, development and qualification were investigated by using 130 um pitch Cu pillar bump in flip chip BGA package without heat spreader. We evaluated 14 nm BEOL film strength and adhesion in the torture tests. After passing the torture tests, the package is evaluated in the CPI reliability tests following the JEDEC standard. We optimized...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.