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3D integration is an emerging technology that allows for the vertical stacking of multiple silicon die. These stacked die are tightly integrated with through-silicon vias and promise significant power and area reductions by replacing long global wires with short vertical connections. This technology necessitates that neighboring logical blocks exist on different layers in the stack. However, such...
Die stacking is a promising new technology that enables integration of devices in the third dimension. It allows the stacking of multiple active layers directly on top of one another with short, dense die-to-die vias providing communication. Previous work has shown significant benefits at all design targets, from stacking memory on logic to partitioning individual architectural units across multiple...
One of the challenges for 3D technology adoption is the insufficient understanding of 3D testing issues and the lack of DFT solutions. This article describes testing challenges for 3D ICs, including problems that are unique to 3D integration, and summarizes early research results in this area. Researchers are investigating various 3D IC manufacturing processes that are particularly relevant to testing...
An updated take on Amdahl's analytical model uses modern design constraints to analyze many-core design alternatives. The revised models provide computer architects with a better understanding of many-core design types, enabling them to make more informed tradeoffs.
DRAMs require periodic refresh for preserving data stored in them. The refresh interval for DRAMs depends on the vendor and the design technology they use. For each refresh in a DRAM row, the stored information in each cell is read out and then written back to itself as each DRAM bit read is self-destructive. The refresh process is inevitable for maintaining data correctness, unfortunately, at the...
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