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A new type of probe card is designed and fabricated for wafer-level integrated circuit (IC) testing. Using micromachining technology, roughly 18000 cantilever-tip probes can be integrated in one 4-in wafer, with a minimum pitch of 90 mum for adjacent probing tips. The probe card employs a silicon-and-metal composite structure, in which the bulk-micromachined silicon cantilever arrays provide uniform...
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