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In article number 1901971, Peining Chen, Bingjie Wang, Huisheng Peng, and co‐workers discuss the application challenges faced by fiber and textile electronics, considering single‐fiber‐based devices, continuously scalable fabrication, encapsulation and testing, and exploration of application modes. The evolutionary trends and new directions for the future study are also highlighted.
Modern electronic devices are moving toward miniaturization and integration with an emerging focus on wearable electronics. Due to their close contact with the human body, wearable electronics have new requirements including low weight, small size, and flexibility. Conventional 3D and 2D electronic devices fail to efficiently meet these requirements due to their rigidity and bulkiness. Hence, a new...
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