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Flip chip packaging as a mainstream packaging interconnect technology has proliferated rapidly within the last decade or so. With the applications of high-performance chip, its thickness and size have been much thinner and bigger, which is challenging the current assembly technique, especially for the reliable peeling of ultrathin die from the wafer due to its vulnerability and flexibility. Here,...
The paper uses economic value added (EVA) as a tool to analyze whether foreign-capital merger and acquisition (M&A) can effectively improve the performance of listed companies in China and the impact degree of the type of foreign-capital M&A on its performance, which will provide investment decision support for a listed company before its acquisition in order to achieve the rational use of...
This paper gives an overview of the sensitivity of AERMOD by comparing the simulated concentrations of SO2 under different model options with the corresponding observed concentrations. While the influence of meteorological conditions on the performance of AERMOD is noticeable, the urban/rural dispersion coefficients and the terrain conditions have only a limited influence on the results from AERMOD...
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