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The effects of aging on the cyclic shear stress–strain and fatigue behavior of lead-free solders have been explored experimentally and have been presented in this paper. An experimental procedure has been developed for preparing Iosipescu shear specimens of SAC105 (Sn–1.0Ag–0.5Cu) lead-free solder, and the resulting solder joint specimens have been subjected to cyclic shear stress/strain loading at...
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