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The 3D IC integration technology may achieve high performance, better reliability in electronic applications. Since the through silicon via (TSV) provides the key connection in 3D IC integration, the reliability issues of TSV are very important. In the TSV architecture, the electroplating copper is filled in the TSV. As the difference of coefficient of thermal expansion (CTE) between silicon and copper...
The parabolic-trough solar concentrator is the key component in parabolic-trough solar thermal power plants. The parabolic-trough solar concentrator is designed in this paper. It was analyzed under operational condition and under snow load. The model of the coefficient of accumulated snow with the different rotational angle is established. The coefficient was calculated with the model for a parabolic-trough...
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