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This paper presents a method for analysis of stress and strain of gas pipelines under the effect of horizontal catastrophic landslides. A soil spring model was used to analyze the nonlinear characteristics concerning the mutual effects between the pipeline and the soil. The Ramberg–Osgood model was used to describe the constitutive relations of pipeline materials. This paper also constructed a finite...
In this study, the drop test simulation for a typical stacked memory device with 8 units integrated vertically on board-level was performed by finite element method. The units were connected with each other through copper lead frames and assembled on the PCB by pins. The computational model of the device was built in ANSYS and the drop test of this board-level assembled device was investigated by...
The stacked memory device that combined eight single memory units in the vertical direction was investigated in this study when the device was subjected to the random vibrations. The fine computational model of the stacked memory with eight units assembled on board-level was built by ANSYS. The modal analysis was carried out first. By applying the power spectrum according to the GJB-548B standard,...
The stacked memory device that combined eight single memory units in the vertical direction was investigated in this study when the device was subjected to the random vibrations. The fine computational model of the stacked memory with eight units assembled on board-level was built by ANSYS. The modal analysis was carried out first. By applying the power spectrum according to the GJB-548B standard,...
In this study, the drop test simulation for a typical stacked memory device with 8 units integrated vertically on board-level was performed by finite element method. The units were connected with each other through copper lead frames and assembled on the PCB by pins. The computational model of the device was built in ANSYS and the drop test of this board-level assembled device was investigated by...
Wafer level Chip Scale Package (WLCSP) fulfills the demand for small, light, and portable handheld electronic devices, and it is one of the most advanced packaging concepts. When the WLCSP was assembled on board level, the connection, i.e. solder joints are generally the critical and challenging issue for the whole device's reliability. In addition to the shape and material of solder joints, the material...
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