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The deposition of platinum on the aluminum electrode by two methods involving electroplating by single step potential from an aqueous buffered H 2 PtCl 6 solution (pH 7) and electroless cementation from an aqueous solution of H 2 PtCl 6 saturated with NaF is described. The electrochemical characteristic of the platinum layer-modified aluminum electrode (Pt/Al) in aqueous...
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