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In the past few years, QFN packages with large body sizes and multi-row external terminals as well as small body devices with ultra-fine pitch pads have emerged as a cost & performance competitive alternative to other BGA style packages, particularly for small form factor products. Due to pb-free and halogen free conversion requirements, green (environmentally friendly) molding compounds have...
With the liberalization of electric market, the customers may have different reliability requirements, which generates different reliability costs to the grid company, that means they should afford different reliability price. An integrated electric power supply reliability differential pricing model was presented considering both the reserve costs and distribution and transmission investment costs...
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