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Enhanced plasma-sputtered copper film adhesion onto polyimide substrates treated by oxygen glow discharge was investigated. The peel test demonstrates this improvement, with peel strengths of 0.7–1.2 g/mm for copper films prepared on un-modified polyimide substrates and 195.5–262.2 g/mm for copper films on oxygen plasma-modified polyimide substrates at certain plasma conditions. The enhanced adhesive...
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