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The packaging industry has devised various die stacking solutions to meet the electronic industry's growing demand for higher memory and functionality. Multiple devices packaged within the same footprint results in higher temperatures which adversely affect thermal performance and reliability. Thermal management and characterization of stacked die packages thus becomes vital. Thermal evaluation of...
This paper presents the thermal evaluation of two die stacked FBGA (D2-FBGA) with identical die structure. Thermal performance was evaluated experimentally with the package size of 15 mmtimes5 mmtimes1.2 mm, 2 signal metal layers, 208 ball count containing an identical die stack configuration with two Delco PST4-02 thermal test dies of 6.35 mmtimes6.35 mm size each. Experiments were carried out using...
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